TSMC announced news regarding its new 3nm and 2nm manufacturing processes with its technology FINFLEX, and these are the N3, N3E and N2. Summarizing the information as much as possible so you don’t waste your valuable time, TSMC says FLINFLEX technology improves the performance, power efficiency and density of its manufacturing processes by enabling chip designers choose the best option for each of the blocks key features on the same die using the same set of design tools. These options include a 3-2 END, 2-2 END and 2-1 END configuration with the following features:
- 3-2 END – The fastest clocks and highest performance for the most demanding computing needs.
- 2-2 END – Efficient performance, a good balance between performance, energy efficiency and density.
- 2-1 END – Ultra energy efficiency, lower power consumption, less leakage and higher density.
Come on, in essence, every chipmaker can choose to have TSMC deliver silicon designed only for high performance, designed for average performance and power consumption, or leave performance aside for maximum power efficiency. Now comes the interestingand this is, for example, in a hybrid design like Intel Alder Lake, you can choose high-performance 3-2 FIN cores, while low-power cores are 2-1 FIN, making high-performance cores even faster and low-power ones even more efficient.
For reference, regarding the current 5nm, TSMC indicates that its N3E 3-2 END offer 33% more frequencies with a 12% reduction in energy consumption; with the N3E 2-2 END the thing is balanced with +23% performance and -22% power consumption; while the N3E 2-1 END improve performance by 11% while consuming -30% energy.
On the other hand, TSMC indicates that its future manufacturing process for 2nm (N2) promises to improve frequencies in 10 to 15% compared to N3 FINFLEX consume the same energy, or consume 25 to 30% less energy at the same frequencies.
“We live in a rapidly changing supercharged digital world, where the demand for computing power and energy efficiency is growing faster than ever, creating unprecedented opportunities and challenges for the semiconductor industry,” said Dr. CC Wei, CEO of TSMC.
“The innovations we will showcase at our technology symposia demonstrate TSMC’s technology leadership and our commitment to supporting our customers through this exciting time of transformation and growth.”