Home » Russian government hopes to produce 28nm wafers by 2030
Technology

Russian government hopes to produce 28nm wafers by 2030

Due to the large number of sanctions that Russia is facing after the invasion of Ukraine, the country has no choice but to make a massive investment to revive semiconductor manufacturingUnable to source chips from its current suppliers, who are prohibited from supplying it with any product, the government has unveiled a preliminary version of its new microelectronics development plan which requires investments of a few $38.43 billion by 2030.

This money will go towards the development of local semiconductor production technologies, the development of national chips, data center infrastructures, the development of local talent and the commercialization of local chips and solutions.

As for semiconductor manufacturing, the country plans to spend about $5 billion on new manufacturing technologies and their start-up. One of the short-term goals is increase local production of chips with 90nm fabrication technology by the end of the year. A longer term goal is to establish manufacturing with a 28 nm manufacturing process by 2030. If they reach the milestone, they will have reached it 19 years after TSMC.

Elbrus-4C

Russia, which has always been very successful in high-tech software and services, has had relatively little success in chip design and manufacturing. Although there are plans to educate local talent and develop chips nationwide, one of the things the country plans to do by the end of the year is to establish a reverse engineering program of “foreign solutions to transfer its manufacture to Russia. All digital items must be made domestically by 2024. Things the country cannot make in-house should be from china.

If all goes as it should, this plan will be finalized and submitted for the approval of the country’s Prime Minister, Mikhail Mishustin, on April 22.

Representatives of the domestic IT sector were very skeptical of the authorities’ new plans for the development of Russian electronics. In particular, an employee of an unidentified large IT company told Kommersant that, despite the real presence of logical and really timely measures in the project, it mainly consists of in proposals disconnected from reality.

“They want to increase the number of design centers to 300 by 2030,” the source said. – Each must employ at least 100 specialists, that is, we are talking about 30-50 thousand people. Knowing that the training cycle of a specialist is at least eight to nine years, these 50,000 people should already enter university”.

Arsene Brykin responsible for the Consortium of Media, Resources and Technology Bases for the production of high-tech products, criticized the idea of ​​reaching the 28nm manufacturing process by 2030. Without mentioning that it is a very old lithograph, which will be 20 years old by then, he said that creating a factory in itself capable of producing 28-nanometer chips is a very difficult task.

“If you can get access to 28nm equipment, in eight years you can create production,” said Arseniy Brykin. “Otherwise you’ll have to go all the way, including launching new materials, big investments in mechanical engineering, optics and lasers.” He added that he considered the move from 90nm to 28nm “extremely ambitious”.

via: cnews

About the author

admin

Add Comment

Click here to post a comment

Your email address will not be published.