Home » Micron and Western Digital will compete for the fastest and cheapest SSDs

Micron and Western Digital will compete for the fastest and cheapest SSDs

We begin with a double short story for the same purpose, namely that the two Micron What WesternDigital showcased their 3D NAND Flash enhancements, with significant layer increases, which will enable the creation of Larger volume SSD. On one side we have Micron, who presented his memory 232-Layer 3D NAND; while on the other side we have Western Digital, with 3D NAND Flash from 162 layers for your SSDs.

The new Western Digital and Micron SSDs: these are their novelties in NAND Flash

We start this battle with Micron, the big winner; where last Thursday it presented its first 3D NAND memory chip from 232 diapers (128 GB) with 1TB ability. This chip takes advantage of the in-die CMOS design (CuA) of Micron to produce 2 3D NAND dies superimposed, realizing reduced costs of manufacturing and more aggressive pricing. While Micron didn’t reveal I/O speeds or how many planes the new 232L 3D NAND TLC consists of, it did say they would be very useful when manufacturing future PCIe 5.0 SSDs.

To do this, Micron’s executive vice president of technology, Scott DeBoer, said the company has worked closely with NAND controller manufacturers to ensure compatibility with this new memory. In addition, this new 3D NAND will have a low power consumption than the previous generation, giving Micron an edge in the mobile and laptop space. Expectations are to increase the production a end of 2022 and it is estimated that the first units they will go out in 2023.

Western Digital Announces BiCS+: 200-Layer 3D NAND Flash

Western Digital BiCS+ NAND Flash

We now pass by wdwhich announced that it would mass-produce its 3D NAND BiCS6 from 162 layers for SSD PCIe 5.0 for end of 2022. This would be the 6th generation of BiCS, with configurations TLC and QLC, something usual in the company. These 162 layers would be behind Micron’s current 176 layers, so WD claims that will reduce the size of the matrix, using a new material. With these changes, the company hopes to make USB and SSD cheaper and with him same performance.

But WD does not stop there, since he also spoke about his next memory BiCS+ with more than 200 layers. It would have a 55% more bits per wafer, one 60% more speed from to transfer and one 15% faster typing speed compared to BiCS6. However, this future BiCS+ will only be used on SSD disks to data centerswhile for the consumers we will have the so-called BiCS-Y; also with more than 200 layers.

Finally, WD ends by stating that it is working on several technologies to improve the density and capacity of SSDs, such as APIs and NAND with more than 500 diapers in the the next decade.

VIA: Guru3D and Techspot

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