Home » Chinese AI chips are gaining popularity in high-end autonomous vehicles

Chinese AI chips are gaining popularity in high-end autonomous vehicles

China’s high-end autonomous vehicle AI chip industry has rebounded, and it has been revealed that the company Horizon Robotics entered the supply chains of BYD Group and FAW (major automakers in the country) with their latest automotive AI processor Trip 5designed for autonomous driving level 4. This means that the vehicle is able to drive on its own, but in specific situations.

On April 21, Shenzhen-based electric vehicle maker BYD teamed up with Horizon to launch some models in 2023, adopting Journey 5 AI chips, becoming the first company to use the chips in its vehicles.

In the middle of this month, FAW also announced that its sedans of the hongqi will use multiple Journey 5 chips to build an intelligent driving domain controller, providing between 384 and 512 TOPS (tera operations per second) of AI computing power for the new generation of service-oriented electrical and electronic architecture FEEA 3.0.

Horizon Robotics Journey 5 AI Chip

As Horizon’s third-generation autonomous driving chip, Journey 5 uses a new generation of dual-core BPU and octa-core processor clusters, with a computing power of 128 TOPSable to bear computer 16 cameras and the multi-sensor fusion, prediction and planning control needs required for autonomous driving, industry sources said.

The sources went on to say that many other Chinese automakers, such as Great Wall Motors, SAIC Motor and Changan, also signed letters of intent to adopt Journey 5 chips d’Horizon in its new electric vehicles. Horizon has joined Mobileye and Nvidia as three global vendors capable of mass-producing smart chips for Tier 2, 3 and 4 autonomous vehicles, the sources said, adding that sales of its Journey series chips reached more than one million units until now.

Hongqi S9 Hybrid Vehicle
Hongqi S9 Hybrid Vehicle

Currently, other Chinese chip vendors are also actively developing chips for self-driving. Black Sesame Technologies plans to start commercial production of its HuaShan-2 A1000 series chips in 2022. Cambricon also plans to release its L2+ and L4 autonomous driving chips in 2022-2023, while SemiDrive plans to release an automotive processor. of 200 TOPS in the fourth quarter of 2022. Huawei also plans to develop high-end autonomous driving chips through its Mobile Data Center (MDC) platform.

via: Digitimes

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